The fifth edition of SEMICON India 2026, held at Yashobhoomi in New Delhi from September 17 to 19, showcased India’s expanding semiconductor ecosystem. Organised around the theme “Silicon to Systems: Building the Ecosystem,” the event brought together more than 600 exhibiting companies, policymakers, investors, researchers, start-ups and industry leaders.
The exhibition highlighted India’s growing capabilities across the semiconductor value chain, from chip design and advanced packaging to materials, equipment, artificial intelligence and high-performance computing.
C-DAC showcased technologies including the AUM HPC-AI Processor and RUDRA-AUM compute node, reflecting efforts to develop indigenous computing capabilities.
RISC-V featured prominently at the exhibition. C-DAC showcased its indigenous 64-bit RISC-V processor, while InCore Semiconductors displayed RISC-V processor intellectual property and system-on-chip design tools.
Aheesa Technology also demonstrated an indigenous internet connectivity device capable of speeds of up to 1 Gbps, powered by C-DAC’s RISC-V processor and designed to support broadband connectivity.
The exhibition demonstrated the growing convergence between semiconductors and artificial intelligence.
Indian start-up Netrasemi showcased AI-enabled system-on-chips for applications such as surveillance, robotics, drones, smart sensors and mobility. The company has taped out an indigenously designed AI SoC for CCTV surveillance using a 12 nm process node.
Other semiconductor solutions displayed at SEMICON India included technologies for motor control, energy meters, consumer appliances, electric mobility and industrial applications.
The wider semiconductor ecosystem was also represented through displays covering materials, equipment, testing, packaging and system integration.
The government’s Semicon 2.0, approved in July 2026 with an outlay of ₹1,27,500 crore, focuses on six areas: chip design, machines and materials, fabs, advanced packaging, R&D and talent development.
The Start-up Pavilion highlighted emerging semiconductor companies and research initiatives. The Design Linked Incentive (DLI) Scheme and Chips to Startup (C2S) Programme are supporting domestic chip-design capabilities.
According to the article, more than one lakh engineers from over 500 organisations have been onboarded through these initiatives, while participating institutions and start-ups have developed more than 300 chip designs for fabrication.
The semiconductor programme is also moving toward manufacturing. Twelve semiconductor projects across six states have been approved, involving investment commitments exceeding ₹1.64 lakh crore, with three facilities already commencing commercial production.
